Compared to cast iron radiators and pure copper radiators, the main benefits of aluminum radiators are mainly reflected in several aspects such as energy-saving, decorative, material saving, price, weight, etc. Due to the efficient thermal conductivity of aluminum alloy, the heat dissipation performance of aluminum profile radiators is more than twice that of cast iron radiators; The low density of aluminum alloy results in radiators of the same volume size. The weight of aluminum profile radiators is about three times lighter than that of pure copper radiators, making transportation and installation quite convenient.

In addition, due to the good thermal conductivity, large heat dissipation, fast heat dissipation, high metal thermal strength, and easy extrusion forming of aluminum radiators, they have a novel and beautiful appearance with strong decorative properties. Due to the protective film formed by aluminum oxidation, which can prevent further oxidation, it is not afraid of oxidation and corrosion. Aluminum radiators are popular among the working class due to their moderate price. Therefore, many friends choose to purchase aluminum profile radiators. Below is a brief introduction to some precautions when installing aluminum profile radiators.

When ensuring that the actual junction temperature of semiconductor power devices is lower than the large junction temperature during operation, specifications with small volume and light weight should be selected. The heat dissipation effect of aluminum profile radiators is closely related to the process of aluminum radiators. When installing aluminum radiators, the contact area between power devices and radiators should be maximized to reduce contact thermal resistance and improve heat transfer efficiency. In addition, try to reduce the contact thermal resistance as much as possible. When installing, adding a thin layer of thermal conductive silicone grease between the power device and the heat sink can reduce the thermal resistance by 25-30%.

Also, when installing an aluminum profile heat sink, it is necessary to place a thermal conductivity or insulation gasket between the device and the aluminum profile heat sink. Low thermal resistance materials such as copper foil, aluminum foil, or thin mica, polyester film, etc. are suitable.

When installing a device, its mounting hole (or group hole) is placed at the center (L/2) of the radiator base surface. When installing two or more devices, the installation holes (or group holes) should be evenly distributed (L/2n) above the centerline of the radiator base. When tightening the devices, it is necessary to ensure that the screw torque is consistent.

After the installation of the aluminum profile heat sink and power device, it is not advisable to perform mechanical processing or shaping on the power device and aluminum profile heat sink, as this will generate stress and increase contact thermal resistance.

Another point to note is the single sided ribbed aluminum profile heat sink, which is suitable for natural air cooling outside the equipment (such as installed outside the chassis), which is conducive to ventilation and heat dissipation of power devices while reducing internal temperature rise.